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Admission requirements

Who can join Cyberport Incubation Programme

Cyberport Incubation Programme is for early-stage Hong Kong companies seeking growth in areas related to digital tech.

What you need to apply
  • A viable business plan for a product or service to be ready for marketing in 12 to 18 months
  • The Applicant must be a registered digital tech company limited by shares (or in progress of incorporation*) and incorporated in Hong Kong less than 7 years upon application deadline.
  • The founders of the Applicant collectively (legally and beneficially) must hold at least 51% of the company shares or absolute control.
  • All Incubatees shall maintain local presence with at least one local authorised representative physically working in Hong Kong (mainly to support local operation and product development) in the incubation period. Such a representative shall be either a Founder/Co-founder or a local full-time staff employed by the Incubatee.

*In any case of pending for incorporation in Companies Registry, the process should be completed within 30 calendar days after the application deadline.

Alternative admission route

Many of our incubatees first completed our Cyberport Creative Micro Fund (CCMF). This programme offers financial support to individuals and start-up companies, and may be more suitable if you have not formed a company.

Project requirements

Cyberport Incubation Programme is only open to digital tech related companies. Incubatees must not and will not receive funding from other publicly-funded organisations and programmes that provide similar support to Cyberport Incubation Programme.


Note: Applicants are required to submit online applications via Cyberport Entrepreneurship Management System. 

Please check out the Incubation Guides and Notes for Applicants before submission.

If you would like to learn more about the programme, please register for the online Programme Information & Sharing Session. Click here for details. 

CyberLink Vol. 182 Nov 2023
CyberLink Vol. 181 Oct 2023
CyberLink Vol. 180 Sep 2023