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Cyberport University Partnership Programme ("CUPP")


The Cyberport University Partnership Programme (CUPP) supported by Cyberport Creative Micro Fund (CCMF)  is a life-changing experience to unleash participants’ full potential and gain insights into the global market! This digital technology-focused entrepreneurship programme with boot camp, mentorship and competition aims at nurturing young digital tech talents for Hong Kong since 2015. The nominated students have unique chance to participate in Overseas Entrepreneurship Boot Camp and receive mentorship from local and international industry elites. The winning teams will receive HK$100,000 grant from CCMF.

For the upcoming cohort, CUPP is themed in Web3 to nurture more young Web3 talents in Hong Kong.


The Programme offers:
-  A series of digital tech pre-camp nurturing sessions in Hong Kong, including the latest Web3 applications sharing, regulation and team building activities
-  An Entrepreneurship Boot Camp at prestigious overseas university
-  Mentorship and insight from Web3 experts, both locally and globally
-  Pitch innovative digital tech business idea to investors
-  Win HK$100,000 grant by Cyberport Creative Micro Fund

Admission Requirement
  • Project must be rooted in digital tech and focus on Web3 related areas

  • Applicants must be nominated by CUPP Co-organising Universities

  • Applicants must be between 18 to 30 years old (inclusive) upon the nomination deadline​

  • Applicants must be undergraduate or postgraduate students from CUPP Co-organising Universities, either currently enrolled university students or recently graduated within 3 years prior to the nomination deadline from the co-organising universities

  • Applicants must have good command of English

  • Team members could be a mixture of students from the CUPP Co-organising Universities

  • Each team could have up to 5 members. Suggested team structure: ​

    • 1 Team Leader (i.e. principal applicant) with Hong Kong ID Card

    • Up to 2 Core Team Members with technical/UIUX/Web3/FinTech knowledge, who will be joining the overseas Entrepreneurship Boot Camp

    • Up to 2 Supporting Team Members, who will NOT be joining the overseas Entrepreneurship Boot Camp

    • Maximum 3 members per team can join the overseas Entrepreneurship Boot Camp



Application process & timeline

Details please refer to Guides and Notes for Applicants


Prizes


Winning teams will receive HK$100,000 grant to Cyberport Creative Micro Fund (CCMF)

About Vetting criteria, vetting team compositions, and Grant Disbursement and Others.




Apply now

CUPP is a programme on nomination based. Interested applicants should contact CUPP Co-organising Universities for nomination.

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City University of Hong Kong
HK Tech 300
E  hktech300.info@cityu.edu.hk   

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Hong Kong Baptist University
Career Centre, Office of Student Affairs
E  becky_poon@hkbu.edu.hk

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Hong Kong Metropolitan University
Lee Shau Kee School of Business and Administration
E  szhang@hkmu.edu.hk

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Lingnan University
Lingnan Entrepreneurship Initiative
E  lei@ln.edu.hk  

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Saint Francis University
Innovative Incubation Center (IIC)
E  rleung@sfu.edu.hk  

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The Chinese University of Hong Kong
PI Centre
E picentre@cuhk.edu.hk

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The Education University of Hong Kong
Entrepreneurship Development Unit (EDuce), Knowledge Transfer Sub-office
E kt@eduhk.hk

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The Hang Seng University of Hong Kong
Department of Economics and Finance
E florenceli@hsu.edu.hk

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The Hong Kong Polytechnic University
Knowledge Transfer and Entrepreneurship Office
E info.kteo@polyu.edu.hk

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The Hong Kong University of Science and Technology
HKUST Entrepreneurship Center
E ecenter@ust.hk

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The University of Hong Kong 
Techno-Entrepreneurship Core
E hkutec@hku.hk


Enquiry Email: training@cyberport.hk


CUPP Web3 2024 Entrepreneurship Boot Camp Partner

 



CUPP Web3 2024 Co-organising Universities

 



CUPP Web3 2024 Honorary Sponsor

 



CUPP Web3 2024 Supporting Organisation

 



CUPP 2015-2023 Entrepreneurship Boot Camp Partners

 

CyberLink Vol. 185 Feb 2024
CyberLink Vol. 184 Jan 2024
CyberLink Vol. 183 Dec 2023